Category


    Markets


    Category


    Markets


    Category


    Markets


    Category


    Markets


    Category


    Markets


    Category


    Markets


    Category


    Markets


Ellsworth Adhesives - Home>Resources>News

Bostik Born2Bond™ UV Cure-In-Place Gasket (UV-CIPG)

 
Bostik, an Arkema company, is a leading global adhesive specialist in construction, consumer and industrial markets. The Born2Bond™ UV-CIPG range is Bostik’s latest innovation in engineering adhesives and has been designed to replace traditional gaskets in production processes and to accommodate modern demands.
 
The technology features high efficiency and precision, can be easily dispensed by robots on smart production lines that assemble gadgets and devices that are growing smaller and more complex. The gasket is cured immediately during application using UV light. Available in a range of viscosities, with varying specifications, these CIPGs are suitable for a wide range of applications and assembly processes across multiple industries, including Automotive and Electronics.
 
Watch this video and learn about Bostik's cure-in-place gasket (CIPG) bonding solutions designed to reduce material waste, decrease labor costs, and more.
 

Features of Born2Bond™ UV-CIPG
 
• Extremely flexible and durable - no cracking when compressed or deformed
• Resistant to temperature fluctuations and chemicals
• High thixotropic indexes resulting in a consistent bead aspect ratio
• Waterproof (IPX7) and dustproof
• Immediate curing using UV light
• Suitable for high-precision automated dispensing
 
Typical Applications of Born2Bond™ UV-CIPG
 
• Wearable devices
• Smartphones
• Tablet PCs
• Digital cameras
• Security cameras
• Automotive electronic (e.g. ADAS, ECUs)
• Enclosures
 
 
Ellsworth Adhesives is authorized distributor of Bostik all over the world. Please feel free to contact us if you have any queries.

Link: https://apac.bostikindustrial.com/?Engineering-Adhesives/Cure-In-Place-Gaskets-New-Bonds-To-Sustain-The-Eco.html