Resinlab™ EP950NMF Gray is a non-metallic filled version of EP950G. It is a one-part rubber modified epoxy designed for bonding metal and other structural material subject to stress at elevated temperature. It has a medium paste like viscosity, which gives minimal sag upon cure at elevated temperature.
Henkel Loctite Output 384 Thermally Conductive Adhesive, a thermally conductive adhesive system designed for bonding heat generating components to heat sinks. The high thermal conductivity provides excellent heat dissipation for thermally sensitive components, while the controlled strength permits field and service repair. In high pot applications this product should be limited to a maximum of 500 volts.
Extreme Pressure Grease containing Molybdenum Disulphide
Dymax EMAX 10070 UV-curable liquid gasket combines the flexibility of Form-In-Place technology (FIP) with the processing advantages of UV curing to provide manufacturers the most productive and flexible way to create gaskets. This product cures completely in seconds upon exposure to UV/Visible light.
LOCTITE GC 10 is a halogen free, zero halogens added, no-clean, low voiding, Pb-free solder paste specially formulated to provide added long-term stability over a wide range of temperature conditions. The enhanced paste stability created through its novel formulation strategy increases both field application yields and on-line paste utilization.