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Ellsworth Adhesives - Home>Products>Adhesives>Resin Designs Epoxy Encapsulants – 042304-10
  • Resin Designs Epoxy Encapsulants – 042304-10
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Part number: Epoxy Encapsulants – 042304-10Manufacturer SKU:
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  • Description
    Epoxy 042304-10 is a room temperature curing, two part epoxy system designed to be used to encapsulate small electronic packages. This one to one mix ratio product provides excellent moisture resistance and is ideal for use in high humidity environments. Once encapsulated with the Epoxy 042304-10 an electronic package will exhibit a higher resistance to both physical shock as well as exposure to water and other potentially harmful chemicals.
  • Product Details
    Typical Use:

    Room temperature cure Short open time, low viscosity general purpose encapsulant for smaller electronics protection, superior water and moisture vapor protection.

    Components:2 Part Epoxy

    Color

    Amber

    Viscosity

    5,000cps

    Hardness:D60
    Elongation50%
    Operating Temperature
    -60 to 135℃
    Applications
    Electronic encapsulation
    Features

    Room temperature cure

    Moisture and chemically resistant

    Physical shock resistant

  • SDS / TDS